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NTMS4840N
Power MOSFET
30 V, 7.5 A, Single N ? Channel, SOIC ? 8
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? SOIC ? 8 Surface Mount Package Saves Board Space
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
? DC ? DC Converters
? Printers
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
30 V
http://onsemi.com
R DS(on) Max
24 m W @ 10 V
36 m W @ 4.5 V
N ? Channel
D
I D Max
7.5 A
Rating
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
Symbol
V DSS
V GS
Value
30
± 20
Unit
V
V
Continuous Drain
Current R q JA (Note 1)
Power Dissipation
R q JA (Note 1)
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
I D
P D
5.5
4.4
1.14
A
W
G
S
T A = 70 ° C
Continuous Drain
Current R q JA (Note 2)
Power Dissipation
R q JA (Note 2)
Continuous Drain
Current R q JA t < 10 s
(Note 1)
Power Dissipation
R q JA t < 10 s (Note 1)
Pulsed Drain Current
T A = 25 ° C
Steady
State T A = 25 ° C
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
T A = 25 ° C,
t p = 10 m s
I D
P D
I D
P D
I DM
4.5
3.5
0.68
7.5
6.0
1.95
38
A
W
A
W
A
1
SO ? 8
CASE 751
STYLE 12
MARKING DIAGRAM
& PIN ASSIGNMENT
1 8
Source Drain
Source Drain
Source Drain
Gate Drain
Top View
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche
Energy T J = 25 ° C, V DD = 30 V, V GS = 10 V,
I L = 7.5 A pk , L = 1.0 mH, R G = 25 W
T J , T STG
I S
EAS
? 55 to
+150
2.0
28
° C
A
mJ
S4840
A
Y
WW
G
= Device Code
= Assembly Location
= Year
= Work Week
= Pb ? Free Package
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
THERMAL RESISTANCE RATINGS
T L
260
° C
ORDERING INFORMATION
Shipping ?
Device
Package
Rating
Junction ? to ? Ambient – Steady State (Note 1)
Symbol
R q JA
Max
110
Unit
NTMS4840NR2G
SOIC ? 8
(Pb ? Free)
2500/Tape & Reel
° C/W
Junction ? to ? Ambient – t ≤ 10 s (Note 1) R q JA 64
Junction ? to ? FOOT (Drain) R q JF 40
Junction ? to ? Ambient – Steady State (Note 2) R q JA 183.5
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface ? mounted on FR4 board using 1 inch sq pad size, 1 oz Cu.
2. Surface ? mounted on FR4 board using the minimum recommended pad size.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2009
September, 2009 ? Rev. 1
1
Publication Order Number:
NTMS4840N/D
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